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1270 Electo Solder Paste

1270 Electo Solder Paste

2200 INR/Pack

Product Details:

  • Size Customized
  • Product Type Solder Paste
  • Usage Commercial
  • Melting Point Normal
  • Coating Polished
  • Click to View more
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1270 Electo Solder Paste Price And Quantity

  • 100 Pack
  • 2200 INR/Pack

1270 Electo Solder Paste Product Specifications

  • Commercial
  • Polished
  • Normal
  • Customized
  • Solder Paste

1270 Electo Solder Paste Trade Information

  • Cash on Delivery (COD)
  • 5000 Pack Per Month
  • 10 Days
  • Asia Australia Central America North America South America Eastern Europe Middle East Africa
  • All India

Product Description

Features Technical Specifications

  • Excellent printing at high speeds, good adhesion.
  • Excellent wettability, Wide Soldering process window.
  • Stable process and reliable product with Bright Shiny color of joints with, reliable solders
  • Reflow operation in room air and Nitrogen.
  • Various reflow soldering methods can be used.

Application Process

  • Storage: Store Solder paste at (2 deg to 10 Deg Celsius).
  • Work Environment: Best performance under 20-25 Deg C, Humidity 40% - 65%
  • Keep Solder paste in room temperature for 3-6 Hours before use.
  • Stir Solder Paste for 1 to 2 minutes after unpacking.
  • For printing SS scrapper at an angle of 45 to 60 Deg can be used. For Hard PU increase angle up to 90 Deg.
  • Printing Pressure normally is kept between 0.04 bar to 0.103 bar and printing speed 25 mm to 50 mm
  • Do not use the remaining solder paste 

Packing

Available in 500 gms and 1 Kg packing 

Technical Specification 

Test Item

Result

Test Standard

Flux Category

ROLO

IPC-J-STD-004

Bronze/ Copper Mirror Test

Qualified

IPC-TM-650 2.3.32

Silver Chromate Test

Pass

IPC-TM-650 2.3.33

Surface Insulation Resistance

7.88 x 10 /11

IPC-TM-650 2.6.3.3

Copper Plate Corrosion

Pass

IPC-TM-650 2.6.15

Acidity

113

IPC-TM-650 2.3.13

Alloy Content

89+/-1%

IPC-TM-650 2.2.20

Flux Residue after reflow Soldering

4.5%

TGA Analysis

Electromigration 

Pass

Bellcore GR-78- CORE 13.1.4

Viscosity

190+/-30 pa.s

IPC-TM-650 2.4.34

Thixotropic Performance

0.55+/-0.1

 

Expansion Rate

90+/-5%

JIS-Z-3197 8.3.1.1

Solder Balls

Pass

IPC-TM-650 2.4.43

Print Life

4-8 hrs

 

Exposure to Air/ Open Time

30-60 min

 

Alloy

Sn99Ag0.3Cu0.7

JIS-Z-3282

Appearance

Gray paste No foreign Particle, No Stiff

 

Melting Point

217-219 Degree C

DSC

Particle Size

Type 4: +38m 1% large,-20m 10% less

IPC-TM-650, 2.2.14

Flux Content

11 JIS-Z-3282 0.2wt%

JIS-Z-3197, 6.1

Halide Contents

Nil in Flux

JIS-Z-3284, Annex 6

Spread Test

75% Up

JIS-Z-3197, 6.10

SIR Test

1x109 up

IPC-TM-650, 2.6.3.3

Tach Test (gf)

140 up ( 8 Hrs)

JIS-Z-3284 Annex 9

Slump Test

Less than 0.3 mm

JIS- Z-3284, Annex 8

Flourides By Spot Test

Pass

IPC-TM650, 2.3.35.1

Alloy Composition SAC-307 SnAgCu

(Sn)

(Ag)

(Cu)

(Ni)

(Ge)

(Zn)

(Al)

(Sb)

(Fe)

(As)

(Bi)

(Cd)

(Pb)

REM.

0.3+/-0.1

0.7+/-0.1

0.06+/-0.02

0.005-0.02

0.002 Max

0.002 Max

0.05 Max

0.02 Max

0.03 Max

0.1 Max

0.002 Max

0.05 Max

Technical Data

Physical Properties

SAC-307 SnAgCu

Hardness Brinell

15HB

Coefficient of Thermal Expansion

Pure Sn-23.5

Tensile Strength psi

4312

Density g/cc

7.39

Electrical Resistivity (mohm-cm)

14.5

Electrical Conductivity %IACS

16.6

Yield Strength, psi

3724

Total Elongation%

27

Joint Shear Strength at 0.1mm/min 20 Degree C

27

Joint Shear Strength at 0.1mm/min 100 Degree C

17

Creep Strength, N/mm2 at 0.1mm/min 20 Degree C

13.0

Creep Strength, N/mm2 at 0.1mm/min 100 Degree C

5

Thermal Conductivity W/m.K

58.7

  


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