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1270 Electo Solder Paste
2200 INR/Pack
Product Details:
- Size Customized
- Usage Commercial
- Product Type Solder Paste
- Melting Point Normal
- Coating Polished
- Click to View more
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1270 Electo Solder Paste Price And Quantity
- 100 Pack
- 2200 INR/Pack
1270 Electo Solder Paste Product Specifications
- Normal
- Polished
- Commercial
- Customized
- Solder Paste
1270 Electo Solder Paste Trade Information
- Cash on Delivery (COD)
- 5000 Pack Per Month
- 10 Days
- Asia Australia Central America North America South America Eastern Europe Middle East Africa
- All India
Product Description
Features Technical Specifications
- Excellent printing at high speeds, good adhesion.
- Excellent wettability, Wide Soldering process window.
- Stable process and reliable product with Bright Shiny color of joints with, reliable solders
- Reflow operation in room air and Nitrogen.
- Various reflow soldering methods can be used.
Application Process
- Storage: Store Solder paste at (2 deg to 10 Deg Celsius).
- Work Environment: Best performance under 20-25 Deg C, Humidity 40% - 65%
- Keep Solder paste in room temperature for 3-6 Hours before use.
- Stir Solder Paste for 1 to 2 minutes after unpacking.
- For printing SS scrapper at an angle of 45 to 60 Deg can be used. For Hard PU increase angle up to 90 Deg.
- Printing Pressure normally is kept between 0.04 bar to 0.103 bar and printing speed 25 mm to 50 mm
- Do not use the remaining solder paste
Packing
Available in 500 gms and 1 Kg packing
Technical Specification
|
Test Item |
Result |
Test Standard |
|
Flux Category |
ROLO |
IPC-J-STD-004 |
|
Bronze/ Copper Mirror Test |
Qualified |
IPC-TM-650 2.3.32 |
|
Silver Chromate Test |
Pass |
IPC-TM-650 2.3.33 |
|
Surface Insulation Resistance |
7.88 x 10 /11 |
IPC-TM-650 2.6.3.3 |
|
Copper Plate Corrosion |
Pass |
IPC-TM-650 2.6.15 |
|
Acidity |
113 |
IPC-TM-650 2.3.13 |
|
Alloy Content |
89+/-1% |
IPC-TM-650 2.2.20 |
|
Flux Residue after reflow Soldering |
4.5% |
TGA Analysis |
|
Electromigration |
Pass |
Bellcore GR-78- CORE 13.1.4 |
|
Viscosity |
190+/-30 pa.s |
IPC-TM-650 2.4.34 |
|
Thixotropic Performance |
0.55+/-0.1 |
|
|
Expansion Rate |
90+/-5% |
JIS-Z-3197 8.3.1.1 |
|
Solder Balls |
Pass |
IPC-TM-650 2.4.43 |
|
Print Life |
4-8 hrs |
|
|
Exposure to Air/ Open Time |
30-60 min |
|
|
Alloy |
Sn99Ag0.3Cu0.7 |
JIS-Z-3282 |
|
Appearance |
Gray paste No foreign Particle, No Stiff |
|
|
Melting Point |
217-219 Degree C |
DSC |
|
Particle Size |
Type 4: +38m 1% large,-20m 10% less |
IPC-TM-650, 2.2.14 |
|
Flux Content |
11 JIS-Z-3282 0.2wt% |
JIS-Z-3197, 6.1 |
|
Halide Contents |
Nil in Flux |
JIS-Z-3284, Annex 6 |
|
Spread Test |
75% Up |
JIS-Z-3197, 6.10 |
|
SIR Test |
1x109 up |
IPC-TM-650, 2.6.3.3 |
|
Tach Test (gf) |
140 up ( 8 Hrs) |
JIS-Z-3284 Annex 9 |
|
Slump Test |
Less than 0.3 mm |
JIS- Z-3284, Annex 8 |
|
Flourides By Spot Test |
Pass |
IPC-TM650, 2.3.35.1 |
Alloy Composition SAC-307 SnAgCu
|
(Sn) |
(Ag) |
(Cu) |
(Ni) |
(Ge) |
(Zn) |
(Al) |
(Sb) |
(Fe) |
(As) |
(Bi) |
(Cd) |
(Pb) |
|
REM. |
0.3+/-0.1 |
0.7+/-0.1 |
0.06+/-0.02 |
0.005-0.02 |
0.002 Max |
0.002 Max |
0.05 Max |
0.02 Max |
0.03 Max |
0.1 Max |
0.002 Max |
0.05 Max |
Technical Data
|
Physical Properties |
SAC-307 SnAgCu |
|
Hardness Brinell |
15HB |
|
Coefficient of Thermal Expansion |
Pure Sn-23.5 |
|
Tensile Strength psi |
4312 |
|
Density g/cc |
7.39 |
|
Electrical Resistivity (mohm-cm) |
14.5 |
|
Electrical Conductivity %IACS |
16.6 |
|
Yield Strength, psi |
3724 |
|
Total Elongation% |
27 |
|
Joint Shear Strength at 0.1mm/min 20 Degree C |
27 |
|
Joint Shear Strength at 0.1mm/min 100 Degree C |
17 |
|
Creep Strength, N/mm2 at 0.1mm/min 20 Degree C |
13.0 |
|
Creep Strength, N/mm2 at 0.1mm/min 100 Degree C |
5 |
|
Thermal Conductivity W/m.K |
58.7 |
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Phone :07971583096
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